Method of forming a transformer assembly
US-11844628-B2 · Dec 19, 2023 · US
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Wang Lejun patents
Wang Lejun is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Lejun |
| Total patents | 6 |
| First publication | Nov 15, 2016 |
| Latest publication | Dec 19, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer level packages of high voltage units for implantable medical devices
US-11213690-B2 · Jan 4, 2022 · US
Implantable medical device including a molded planar transformer
US-2020352508-A1 · Nov 12, 2020 · US
Implantable medical device including a molded planar transformer
US-2017086740-A1 · Mar 30, 2017 · US
Implantable medical device including a molded planar transformer
US-9607759-B2 · Mar 28, 2017 · US
Integrated circuit packaging for implantable medical devices
US-9496241-B2 · Nov 15, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Medtronic Inc | 6 |
| Boone Mark R | 1 |
| Askarinya Mohsen | 1 |
| Crutchfield Randolph E | 1 |
| Herrmann Erik J | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01F2027/2819 | 5 |
| H01F27/2804 | 4 |
| A61N1/3956 | 4 |
| H01F27/24 | 4 |
| A61N1/3758 | 4 |