Method for manufacturing semiconductor device and substrate processing apparatus
US-9856560-B2 · Jan 2, 2018 · US
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Wang Jie patents
Wang Jie is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Jie |
| Total patents | 4 |
| First publication | Oct 6, 2015 |
| Latest publication | Jan 2, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-9530641-B2 · Dec 27, 2016 · US
Method for manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2015303054-A1 · Oct 22, 2015 · US
Substrate processing apparatus, method of manufacturing semiconductor device and program
US-9153430-B2 · Oct 6, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Int Electric Inc | 4 |
| Kameda Kenji | 1 |
| Wang Jie | 1 |
| Urano Yuji | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/69215 | 2 |
| H10P14/6687 | 2 |
| H10P14/6682 | 2 |
| H10P14/6339 | 2 |
| H10P14/6336 | 2 |