Printed circuit board with embedded bump pads
US-2023345633-A1 · Oct 26, 2023 · US
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Wang Jackson patents
Wang Jackson is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Jackson |
| Total patents | 1 |
| First publication | Oct 26, 2023 |
| Latest publication | Oct 26, 2023 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Western Digital Tech Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/111 | 1 |
| H05K3/4007 | 1 |
| H05K3/24 | 1 |
| H05K2201/10378 | 1 |
| H05K2201/10734 | 1 |