Line bending control for memory applications
US-2025234503-A1 · Jul 17, 2025 · US
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Van Cleemput Patrick patents
Van Cleemput Patrick is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Van Cleemput Patrick |
| Total patents | 27 |
| First publication | Feb 15, 2018 |
| Latest publication | Jul 17, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-12331396-B2 · Jun 17, 2025 · US
Metal deposition
US-2025115998-A1 · Apr 10, 2025 · US
Line bending control for memory applications
US-12274047-B2 · Apr 8, 2025 · US
Non-metal incorporation in molybdenum on dielectric surfaces
US-2024234152-A9 · Jul 11, 2024 · US
Line bending control for memory applications
US-2024172413-A1 · May 23, 2024 · US
Non-metal incorporation in molybdenum on dielectric surfaces
US-2024136192-A1 · Apr 25, 2024 · US
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-2024084443-A1 · Mar 14, 2024 · US
Deposition tool and method for depositing metal oxide films on organic materials
US-11887846-B2 · Jan 30, 2024 · US
Line bending control for memory applications
US-11864372-B2 · Jan 2, 2024 · US
Recent patents
Latest publications not already listed above.
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-11827976-B2 · Nov 28, 2023 · US
Metal-containing passivation for high aspect ratio etch
US-11670516-B2 · Jun 6, 2023 · US
Method to create air gaps
US-11637037-B2 · Apr 25, 2023 · US
Line bending control for memory applications
US-2022028864-A1 · Jan 27, 2022 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-11183383-B2 · Nov 23, 2021 · US
Metal-containing passivation for high aspect ratio etch
US-2021242032-A1 · Aug 5, 2021 · US
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-2020407842-A1 · Dec 31, 2020 · US
Self-limiting growth
US-2020402846-A1 · Dec 24, 2020 · US
Low resistivity films containing molybdenum
US-2020365456-A1 · Nov 19, 2020 · US
Methods for controlling plasma glow discharge in a plasma chamber
US-10777386-B2 · Sep 15, 2020 · US
Method to create air gaps
US-2020219758-A1 · Jul 9, 2020 · US
Tin oxide thin film spacers in semiconductor device manufacturing
US-2020219725-A1 · Jul 9, 2020 · US
Deposition tool and method for depositing metal oxide films on organic materials
US-2020199751-A1 · Jun 25, 2020 · US
Deposition tool and method for depositing metal oxide films on organic materials
US-2019390341-A1 · Dec 26, 2019 · US
Methods and Systems for Controlling Plasma Glow Discharge in a Plasma Chamber
US-2019115190-A1 · Apr 18, 2019 · US
Additive for ALD deposition profile tuning in gap features
US-10246774-B2 · Apr 2, 2019 · US
Additive for ald deposition profile tuning in gap features
US-2018044790-A1 · Feb 15, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 27 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6339 | 20 |
| H10P14/432 | 13 |
| H10P14/6336 | 12 |
| C23C16/45544 | 10 |
| H10P14/43 | 10 |