External contact element for a power semiconductor module and power semiconductor module
US-11810889-B2 · Nov 7, 2023 · US
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Uhlemann Andre patents
Uhlemann Andre is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Uhlemann Andre |
| Total patents | 17 |
| First publication | Feb 24, 2015 |
| Latest publication | Nov 7, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Power semiconductor module, system including a power semiconductor module and a cooler and method for fabricating a system
US-2023317560-A1 · Oct 5, 2023 · US
Circuit board having a cooling area above and below a semiconductor chip
US-11778735-B2 · Oct 3, 2023 · US
Snubber circuit and power semiconductor module with snubber circuit
US-11631974-B2 · Apr 18, 2023 · US
Power semiconductor module and method for producing a power semiconductor module
US-11598904-B2 · Mar 7, 2023 · US
External contact element for a power semiconductor module and power semiconductor module
US-2022278070-A1 · Sep 1, 2022 · US
Circuit board having a cooling area above and below a semiconductor chip
US-2022183147-A1 · Jun 9, 2022 · US
Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip
US-11266012-B2 · Mar 1, 2022 · US
Snubber Circuit and Power Semiconductor Module with Snubber Circuit
US-2021006062-A1 · Jan 7, 2021 · US
Circuit Board, Chip Cooling Housing, Assembly and Method for Cooling a Semiconductor Chip
US-2020196441-A1 · Jun 18, 2020 · US
Recent patents
Latest publications not already listed above.
Power Semiconductor Module and Method for Producing a Power Semiconductor Module
US-2020183056-A1 · Jun 11, 2020 · US
Directly Cooled Substrates for Semiconductor Modules
US-2017304922-A1 · Oct 26, 2017 · US
Directly cooled substrates for semiconductor modules and corresponding manufacturing methods
US-9731370-B2 · Aug 15, 2017 · US
Power semiconductor module with liquid cooling
US-9578789-B2 · Feb 21, 2017 · US
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
US-9275926-B2 · Mar 1, 2016 · US
Cold Plate, Device Comprising a Cold Plate and Method for Fabricating a Cold Plate
US-2016056088-A1 · Feb 25, 2016 · US
Semiconductor device including cladded base plate
US-8963321-B2 · Feb 24, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 17 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/47 | 11 |
| H01L23/473 | 11 |
| H10W90/00 | 7 |
| H10W74/00 | 6 |
| H05K1/185 | 6 |