Method for manufacturing semiconductor device and semiconductor device
US-2026040857-A1 · Feb 5, 2026 · US
Terada Jun is listed as an inventor on 109 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Terada Jun |
| Total patents | 109 |
| First publication | Aug 13, 2015 |
| Latest publication | Feb 5, 2026 |
Publications ranked by popularity score, then publication date.
US-2026040857-A1 · Feb 5, 2026 · US
US-12477829-B2 · Nov 18, 2025 · US
US-2025343545-A1 · Nov 6, 2025 · US
US-2025276393-A1 · Sep 4, 2025 · US
US-12395169-B2 · Aug 19, 2025 · US
US-12383980-B2 · Aug 12, 2025 · US
US-12231172-B2 · Feb 18, 2025 · US
US-12225446-B2 · Feb 11, 2025 · US
US-12206456-B2 · Jan 21, 2025 · US
US-12114201-B2 · Oct 8, 2024 · US
Latest publications not already listed above.
US-12058557-B2 · Aug 6, 2024 · US
US-12047848-B2 · Jul 23, 2024 · US
US-12010521-B2 · Jun 11, 2024 · US
US-12009844-B2 · Jun 11, 2024 · US
US-11973531-B2 · Apr 30, 2024 · US
US-11924111-B2 · Mar 5, 2024 · US
US-11924740-B2 · Mar 5, 2024 · US
US-11923950-B2 · Mar 5, 2024 · US
US-11909658-B2 · Feb 20, 2024 · US
US-11909329-B2 · Feb 20, 2024 · US
US-11888581-B2 · Jan 30, 2024 · US
US-11825395-B2 · Nov 21, 2023 · US
US-11811448-B2 · Nov 7, 2023 · US
US-11804897-B2 · Oct 31, 2023 · US
US-11804920-B2 · Oct 31, 2023 · US
US-2023344427-A1 · Oct 26, 2023 · US
US-11784639-B2 · Oct 10, 2023 · US
US-2023311243-A1 · Oct 5, 2023 · US
US-11777607-B2 · Oct 3, 2023 · US
US-11736186-B2 · Aug 22, 2023 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nippon Telegraph & Telephone | 92 |
| Rohm Co Ltd | 10 |
| Furukawa Electric Co Ltd | 7 |
| Nippon Telegraph & Telephone | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04W88/085 | 18 |
| H04W88/08 | 14 |
| H04B10/272 | 14 |
| H04W92/12 | 12 |
| H04L12/44 | 12 |