Magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips
US-12562772-B2 · Feb 24, 2026 · US
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Sun Chonghui patents
Sun Chonghui is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sun Chonghui |
| Total patents | 4 |
| First publication | May 16, 2024 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package
US-12368324-B2 · Jul 22, 2025 · US
Magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips
US-2024171209-A1 · May 23, 2024 · US
Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package
US-2024162751-A1 · May 16, 2024 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Zhejiang | 4 |
| Jcet Group Co Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03F3/2173 | 2 |
| H03K5/249 | 2 |
| H03F3/45273 | 2 |
| H04B1/40 | 2 |
| H04L12/02 | 2 |