Atomic layer etching of tungsten for enhanced tungsten deposition fill
US-2022115244-A1 · Apr 14, 2022 · US
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Su Teh-Tien patents
Su Teh-Tien is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Su Teh-Tien |
| Total patents | 7 |
| First publication | Feb 9, 2017 |
| Latest publication | Apr 14, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Atomic layer etching of tungsten for enhanced tungsten deposition fill
US-2021305059-A1 · Sep 30, 2021 · US
Atomic layer etch of tungsten for enhanced tungsten deposition fill
US-11069535-B2 · Jul 20, 2021 · US
Atomic layer etch of tungsten for enhanced tungsten deposition fill
US-2020286743-A1 · Sep 10, 2020 · US
Atomic layer etch of tungsten for enhanced tungsten deposition fill
US-2018240682-A1 · Aug 23, 2018 · US
Atomic layer etching of tungsten for enhanced tungsten deposition fill
US-9972504-B2 · May 15, 2018 · US
Atomic layer etching of tungsten for enhanced tungsten deposition fill
US-2017040214-A1 · Feb 9, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0595 | 7 |
| H10P14/43 | 7 |
| H10W20/056 | 7 |
| H10P50/267 | 7 |
| H01L21/32136 | 7 |