Package comprising substrate with coupling element for integrated devices
US-12027476-B2 · Jul 2, 2024 · US
Song Peng is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Song Peng |
| Total patents | 8 |
| First publication | Jul 9, 2015 |
| Latest publication | Jul 2, 2024 |
Publications ranked by popularity score, then publication date.
US-12027476-B2 · Jul 2, 2024 · US
US-2023223362-A1 · Jul 13, 2023 · US
US-9483734-B2 · Nov 1, 2016 · US
US-2016203405-A1 · Jul 14, 2016 · US
US-9280740-B1 · Mar 8, 2016 · US
US-9171259-B1 · Oct 27, 2015 · US
US-9092561-B2 · Jul 28, 2015 · US
US-2015193377-A1 · Jul 9, 2015 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Bank Of America | 5 |
| Qualcomm Inc | 2 |
| Miao Lidan | 1 |
| Song Peng | 1 |
| Zhang Li | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06N5/022 | 4 |
| G06F30/00 | 4 |
| G06N20/00 | 4 |
| G06N99/005 | 4 |
| G06N20/20 | 4 |