Method for manufacturing semiconductor device by removing carrier after forming re-distribution layer
US-12593657-B2 · Mar 31, 2026 · US
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Sobue Shogo patents
Sobue Shogo is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sobue Shogo |
| Total patents | 25 |
| First publication | Nov 29, 2018 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
US-12581907-B2 · Mar 17, 2026 · US
Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device
US-12509613-B2 · Dec 30, 2025 · US
Substrate-conveying support tape and electronic apparatus/device production method
US-12509615-B2 · Dec 30, 2025 · US
Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
US-12476201-B2 · Nov 18, 2025 · US
Semiconductor device manufacturing method
US-2025046626-A1 · Feb 6, 2025 · US
Semiconductor device manufacturing method
US-12165882-B2 · Dec 10, 2024 · US
Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device
US-12094749-B2 · Sep 17, 2024 · US
Method for manufacturing semiconductor device
US-2024145256-A1 · May 2, 2024 · US
Method for manufacturing semiconductor device
US-2024030183-A1 · Jan 25, 2024 · US
Recent patents
Latest publications not already listed above.
Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device
US-2024021443-A1 · Jan 18, 2024 · US
Method for manufacturing semiconductor device
US-2024006192-A1 · Jan 4, 2024 · US
Method for manufacturing semiconductor device
US-2024006222-A1 · Jan 4, 2024 · US
Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device
US-2023360947-A1 · Nov 9, 2023 · US
Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
US-2023197630-A1 · Jun 22, 2023 · US
Substrate-conveying support tape and electronic apparatus/device production method
US-2023039482-A1 · Feb 9, 2023 · US
Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device
US-2022363954-A1 · Nov 17, 2022 · US
Semiconductor device manufacturing method
US-2022319872-A1 · Oct 6, 2022 · US
Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing method
US-2022289920-A1 · Sep 15, 2022 · US
Resin composition for temporary fixing use, resin film for temporary fixing use, sheet for temporary fixing use, and method for manufacturing semiconductor device
US-2022059388-A1 · Feb 24, 2022 · US
Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing
US-2021206149-A1 · Jul 8, 2021 · US
Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing
US-10913248-B2 · Feb 9, 2021 · US
Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
US-10825694-B2 · Nov 3, 2020 · US
Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
US-2020006087-A1 · Jan 2, 2020 · US
Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing
US-2018339497-A1 · Nov 29, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Resonac Corp | 12 |
| Showa Denko Materials Co Ltd | 9 |
| Hitachi Chemical Co Ltd | 4 |
| Showa Denko Materials Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/7416 | 22 |
| H10W74/019 | 18 |
| H10P72/7402 | 18 |
| H10P72/74 | 17 |
| H10P72/744 | 16 |