Method for producing a semiconductor module arrangement
US-11596077-B2 · Feb 28, 2023 · US
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Sielaff Michael patents
Sielaff Michael is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sielaff Michael |
| Total patents | 8 |
| First publication | Apr 21, 2016 |
| Latest publication | Feb 28, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Molded package with chip carrier comprising brazed electrically conductive layers
US-10283432-B2 · May 7, 2019 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-2019006260-A1 · Jan 3, 2019 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-10074590-B1 · Sep 11, 2018 · US
Method for Producing a Semiconductor Module Arrangement
US-2018146566-A1 · May 24, 2018 · US
Semiconductor module arrangement and method for producing a semiconductor module arrangement
US-9888601-B2 · Feb 6, 2018 · US
Power semiconductor module
US-D762185-S · Jul 26, 2016 · US
Method for Soldering a Circuit Carrier to a Carrier Plate
US-2016113123-A1 · Apr 21, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/692 | 4 |
| H05K7/20409 | 3 |
| H05K7/02 | 3 |
| H05K7/209 | 3 |
| H01L2924/00 | 3 |