Plating apparatus
US-2025116024-A1 · Apr 10, 2025 · US
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Shimada Tomokazu patents
Shimada Tomokazu is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shimada Tomokazu |
| Total patents | 7 |
| First publication | Apr 19, 2016 |
| Latest publication | Apr 10, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Plating apparatus
US-2025116029-A1 · Apr 10, 2025 · US
Plating apparatus
US-2025116025-A1 · Apr 10, 2025 · US
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
US-10876000-B2 · Dec 29, 2020 · US
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module
US-2019169432-A1 · Jun 6, 2019 · US
CMP polishing solution and polishing method
US-9944827-B2 · Apr 17, 2018 · US
CMP polishing liquid and polishing method
US-9318346-B2 · Apr 19, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 5 |
| Murata Manufacturing Co | 3 |
| Mishima Kouji | 1 |
| Sakurada Takafumi | 1 |
| Shimada Tomokazu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D5/08 | 3 |
| C25D21/10 | 3 |
| C25D17/28 | 3 |
| H10P52/403 | 2 |
| H10P52/00 | 2 |