Wiring structure, method of manufacturing the same, and imaging device
US-12514017-B2 · Dec 30, 2025 · US
Sejima Koichi is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sejima Koichi |
| Total patents | 8 |
| First publication | Feb 28, 2019 |
| Latest publication | Dec 30, 2025 |
Publications ranked by popularity score, then publication date.
US-12514017-B2 · Dec 30, 2025 · US
US-12317612-B2 · May 27, 2025 · US
US-2023268369-A1 · Aug 24, 2023 · US
US-2022367558-A1 · Nov 17, 2022 · US
US-11456323-B2 · Sep 27, 2022 · US
US-10923531-B2 · Feb 16, 2021 · US
US-2020321364-A1 · Oct 8, 2020 · US
US-2019067367-A1 · Feb 28, 2019 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sony Semiconductor Solutions Corp | 6 |
| Sony Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10F39/811 | 6 |
| H10F39/199 | 4 |
| H10F39/807 | 4 |
| H10W20/01 | 4 |
| H10W20/40 | 4 |