Method and system for 3d reconstruction of wafer structure by diagonal milling
US-2025391707-A1 · Dec 25, 2025 · US
Segal Dan is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Segal Dan |
| Total patents | 3 |
| First publication | Sep 9, 2021 |
| Latest publication | Dec 25, 2025 |
Publications ranked by popularity score, then publication date.
US-2025391707-A1 · Dec 25, 2025 · US
US-11301987-B2 · Apr 12, 2022 · US
US-2021279848-A1 · Sep 9, 2021 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Israel Ltd | 3 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01N23/2251 | 3 |
| H10P74/203 | 3 |
| G06T2207/30148 | 2 |
| G01Q30/02 | 2 |
| G01Q60/44 | 2 |