Semiconductor device including bonding pad metal layer structure
US-12183696-B2 · Dec 31, 2024 · US
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Rupp Thomas patents
Rupp Thomas is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rupp Thomas |
| Total patents | 6 |
| First publication | Dec 27, 2018 |
| Latest publication | Dec 31, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor Device Including Bonding Pad Metal Layer Structure
US-2023395539-A1 · Dec 7, 2023 · US
Semiconductor device including bonding pad metal layer structure
US-11764176-B2 · Sep 19, 2023 · US
Method of manufacturing a superjunction semiconductor device
US-11329126-B2 · May 10, 2022 · US
Semiconductor Device Including Bonding Pad Metal Layer Structure
US-2022059477-A1 · Feb 24, 2022 · US
Method of Manufacturing a Superjunction Semiconductor Device
US-2018374919-A1 · Dec 27, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/5524 | 4 |
| H10W20/4424 | 4 |
| H10W20/4407 | 4 |
| H10W20/40 | 4 |
| H10W72/5473 | 4 |