Copper Electrodeposition in Microelectronics
US-2024018678-A1 · Jan 18, 2024 · US
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Rouya Eric patents
Rouya Eric is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rouya Eric |
| Total patents | 7 |
| First publication | May 21, 2019 |
| Latest publication | Jan 18, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Cobalt filling of interconnects in microelectronics
US-11434578-B2 · Sep 6, 2022 · US
Cobalt Filling of Interconnects in Microelectronics
US-2021222314-A1 · Jul 22, 2021 · US
Cobalt filling of interconnects in microelectronics
US-10995417-B2 · May 4, 2021 · US
Cobalt Filling of Interconnects in Microelectronics
US-2020040478-A1 · Feb 6, 2020 · US
Copper Electrodeposition in Microelectronics
US-2019390356-A1 · Dec 26, 2019 · US
Levelers for copper deposition in microelectronics
US-10294574-B2 · May 21, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Macdermid Enthone Inc | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.