Systems and methods for inspection and metrology of vertical interconnect access in semiconductor substrates
US-2026098718-A1 · Apr 9, 2026 · US
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Rosenberg Boaz patents
Rosenberg Boaz is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rosenberg Boaz |
| Total patents | 5 |
| First publication | Aug 17, 2023 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for reconstruction of digital holograms
US-12535769-B2 · Jan 27, 2026 · US
In-situ wafer stress measurement by chromatic confocal sensor scanning with vibration compensation
US-2025354803-A1 · Nov 20, 2025 · US
In-situ wafer stress measurement by chromatic confocal sensor scanning with temperature compensation
US-2025354801-A1 · Nov 20, 2025 · US
Systems and Methods for Reconstruction of Digital Holograms
US-2023259070-A1 · Aug 17, 2023 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Orbotech Ltd | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01B11/2441 | 3 |
| G01B9/02078 | 2 |
| G01B9/02047 | 2 |
| G03H1/0443 | 2 |
| H10P72/0454 | 2 |