Memory system package structure and manufacturing method thereof
US-12593718-B2 · Mar 31, 2026 · US
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Qian Weisong patents
Qian Weisong is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Qian Weisong |
| Total patents | 3 |
| First publication | May 30, 2024 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaging methods and packaging apparatus
US-2025079191-A1 · Mar 6, 2025 · US
Memory system package structure and manufacturing method thereof
US-2024178089-A1 · May 30, 2024 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W99/00 | 2 |
| H10W72/075 | 2 |
| H10W70/635 | 2 |
| H10W42/20 | 2 |
| H10W74/117 | 2 |