Fill of vias in single and dual damascene structures using self-assembled monolayer
US-12598977-B2 · Apr 7, 2026 · US
Plombon John is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Plombon John |
| Total patents | 2 |
| First publication | Jun 22, 2023 |
| Latest publication | Apr 7, 2026 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/4473 | 2 |
| H10W20/425 | 2 |
| H10W20/084 | 2 |
| H10W20/076 | 2 |
| H10W20/057 | 2 |