Computer implemented method for defect detection in an imaging dataset of a wafer, corresponding computer-readable medium, computer program product and systems making use of such methods
US-2025216842-A1 · Jul 3, 2025 · US
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Persch Johannes patents
Persch Johannes is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Persch Johannes |
| Total patents | 5 |
| First publication | Jun 22, 2023 |
| Latest publication | Jul 3, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
3d volume inspection of semiconductor wafers with increased throughput and accuracy
US-2025022680-A1 · Jan 16, 2025 · US
Measurement method and apparatus for semiconductor features with increased throughput
US-2024311698-A1 · Sep 19, 2024 · US
Segmentation or cross sections of high aspect ratio structures
US-2024087134-A1 · Mar 14, 2024 · US
Measurement method and apparatus for semiconductor features with increased throughput
US-2023196189-A1 · Jun 22, 2023 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Zeiss Carl Smt Gmbh | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01J2237/24592 | 3 |
| G06T2207/10061 | 3 |
| G06T7/0004 | 2 |
| H01J37/222 | 2 |
| G06N20/00 | 2 |