Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
US-10002857-B2 · Jun 19, 2018 · US
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Pendse Rajendra patents
Pendse Rajendra is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pendse Rajendra |
| Total patents | 3 |
| First publication | Sep 21, 2017 |
| Latest publication | Jun 19, 2018 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/142 | 3 |
| H10W74/15 | 3 |
| H10W90/724 | 3 |
| H10W74/117 | 3 |
| H10W70/635 | 3 |