Moisture seal coating of hybrid bonded stacked die package assembly
US-12469801-B2 · Nov 11, 2025 · US
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Pelto Christopher patents
Pelto Christopher is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pelto Christopher |
| Total patents | 8 |
| First publication | Jun 22, 2023 |
| Latest publication | Nov 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Simulating die rotation to minimize area overhead of reticle stitching for stacked dies
US-12436467-B2 · Oct 7, 2025 · US
Interlayer dielectric stack optimization for wafer bow reduction
US-12431441-B2 · Sep 30, 2025 · US
And double patterning strategy with printed erasable dummification
US-2025006495-A1 · Jan 2, 2025 · US
Interlayer dielectric stack optimization for wafer bow reduction
US-2023207486-A1 · Jun 29, 2023 · US
Ic die stacking with mixed hybrid and solder bonding
US-2023207525-A1 · Jun 29, 2023 · US
Simulating die rotation to minimize area overhead of reticle stitching for stacked dies
US-2023205094-A1 · Jun 29, 2023 · US
Moisture seal coating of hybrid bonded stacked die package assembly
US-2023197637-A1 · Jun 22, 2023 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 5 |
| H10W74/014 | 4 |
| H10W90/297 | 3 |
| H10W44/20 | 3 |
| H10W20/081 | 2 |