Method of forming a MEOL contact structure
US-12538542-B2 · Jan 27, 2026 · US
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Or David T patents
Or David T is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Or David T |
| Total patents | 22 |
| First publication | Mar 12, 2015 |
| Latest publication | Jan 27, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of bottom reaction efficiency modulation for ald and ale
US-2025379059-A1 · Dec 11, 2025 · US
Mitigation of first wafer effect
US-2024379343-A1 · Nov 14, 2024 · US
Method of forming a meol contact structure
US-2024379768-A1 · Nov 14, 2024 · US
Process chamber with pressure charging and pulsing capability
US-2024153790-A1 · May 9, 2024 · US
Multi-step pre-clean for selective metal gap fill
US-11776806-B2 · Oct 3, 2023 · US
Selective Passivation Of Damaged Nitride
US-2023136499-A1 · May 4, 2023 · US
Multi-step pre-clean for selective metal gap fill
US-2022270871-A1 · Aug 25, 2022 · US
Multi-step pre-clean for selective metal gap fill
US-11380536-B2 · Jul 5, 2022 · US
Method for forming a metal gapfill
US-11355391-B2 · Jun 7, 2022 · US
Recent patents
Latest publications not already listed above.
Multi-Step Pre-Clean for Selective Metal Gap Fill
US-2021351032-A1 · Nov 11, 2021 · US
Method for forming a metal gapfill
US-2020303250-A1 · Sep 24, 2020 · US
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition
US-9653318-B2 · May 16, 2017 · US
Plasma cleaning apparatus and method
US-9552968-B2 · Jan 24, 2017 · US
Directional sio2 etch using plasma pre-treatment and high-temperature etchant deposition
US-2016247689-A1 · Aug 25, 2016 · US
Etch enhancement via controlled introduction of chamber contaminants
US-2016133441-A1 · May 12, 2016 · US
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition
US-9245769-B2 · Jan 26, 2016 · US
Directional SiO2 etch using low-temperature etchant deposition and plasma post-treatment
US-9202745-B2 · Dec 1, 2015 · US
Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition
US-9177780-B2 · Nov 3, 2015 · US
Process chamber lid design with built-in plasma source for short lifetime species
US-9004006-B2 · Apr 14, 2015 · US
Directional SIO2 etch using low-temperature etchant deposition and plasma post-treatment
US-8980761-B2 · Mar 17, 2015 · US
Directional sio2 etch using plasma pre-treatment and high-temperature etchant deposition
US-2015072508-A1 · Mar 12, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 22 |
| Kao Chien-Teh | 1 |
| Lam Hyman W H | 1 |
| Chang Mei | 1 |
| Or David T | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/081 | 9 |
| H10P70/20 | 8 |
| H10P50/283 | 8 |
| H01L21/31116 | 7 |
| H10P70/234 | 7 |