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US-2026042340-A1 · Feb 12, 2026 · US
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Murai Yusuke patents
Murai Yusuke is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Murai Yusuke |
| Total patents | 10 |
| First publication | Jul 14, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface performance evaluation device, surface performance evaluation method, and surface performance evaluation program
US-12400342-B2 · Aug 26, 2025 · US
Surface performance evaluation device, surface performance evaluation method, and surface performance evaluation program
US-2023140945-A1 · May 11, 2023 · US
Printed circuit board
US-9894751-B2 · Feb 13, 2018 · US
Printed wiring board, semiconductor device and printed circuit board
US-9693450-B2 · Jun 27, 2017 · US
Printed circuit board
US-2016157336-A1 · Jun 2, 2016 · US
Printed wiring board, semiconductor device and printed circuit board
US-2016143133-A1 · May 19, 2016 · US
Semiconductor package and printed circuit board
US-9345126-B2 · May 17, 2016 · US
Printed circuit board
US-9326370-B2 · Apr 26, 2016 · US
Printed circuit board and printed wiring board
US-9084364-B2 · Jul 14, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Canon Kk | 7 |
| Toyota Motor Co Ltd | 2 |
| Nishikawa Rubber Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/181 | 4 |
| H05K1/0225 | 3 |
| H10W70/65 | 3 |
| H05K1/0231 | 3 |
| H01L23/49838 | 3 |