Semiconductor device
US-12095461-B2 · Sep 17, 2024 · US
Moriyama Daisuke is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Moriyama Daisuke |
| Total patents | 16 |
| First publication | Apr 19, 2016 |
| Latest publication | Sep 17, 2024 |
Publications ranked by popularity score, then publication date.
US-12095461-B2 · Sep 17, 2024 · US
US-2023155592-A1 · May 18, 2023 · US
US-11516024-B2 · Nov 29, 2022 · US
US-11290257-B2 · Mar 29, 2022 · US
US-11012230-B2 · May 18, 2021 · US
US-10949527-B2 · Mar 16, 2021 · US
US-10931447-B2 · Feb 23, 2021 · US
US-2020351108-A1 · Nov 5, 2020 · US
US-2019342081-A1 · Nov 7, 2019 · US
US-2019156018-A1 · May 23, 2019 · US
Latest publications not already listed above.
US-2019068368-A1 · Feb 28, 2019 · US
US-2018337923-A1 · Nov 22, 2018 · US
US-9783796-B2 · Oct 10, 2017 · US
US-9376667-B2 · Jun 28, 2016 · US
US-2016145585-A1 · May 26, 2016 · US
US-9315782-B2 · Apr 19, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Renesas Electronics Corp | 12 |
| Kaneka Corp | 4 |
| Moriyama Daisuke | 2 |
| Nishiyama Tozo | 2 |
| Taoka Naoaki | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04L9/0869 | 8 |
| G06F21/79 | 6 |
| G06F21/72 | 4 |
| H04L9/3247 | 4 |
| H04L9/0662 | 4 |