Semiconductor module
US-2025309206-A1 · Oct 2, 2025 · US
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Morinaga Yuji patents
Morinaga Yuji is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Morinaga Yuji |
| Total patents | 38 |
| First publication | Sep 1, 2016 |
| Latest publication | Oct 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor module
US-2025309023-A1 · Oct 2, 2025 · US
Semiconductor circuit
US-2025300653-A1 · Sep 25, 2025 · US
Electronic module
US-2025239532-A1 · Jul 24, 2025 · US
Electrical connecting member and semiconductor device
US-2025183218-A1 · Jun 5, 2025 · US
Semiconductor module
US-2025140652-A1 · May 1, 2025 · US
Semiconductor module
US-2025140656-A1 · May 1, 2025 · US
Semiconductor module
US-2024379572-A1 · Nov 14, 2024 · US
Semiconductor module
US-2024347466-A1 · Oct 17, 2024 · US
Semiconductor module
US-2024312921-A1 · Sep 19, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor module
US-2024312922-A1 · Sep 19, 2024 · US
Electronic device, connection body, and manufacturing method for electronic device
US-11404353-B2 · Aug 2, 2022 · US
Electronic device and connection body
US-11211311-B2 · Dec 28, 2021 · US
Electronic device and connection body
US-10910292-B2 · Feb 2, 2021 · US
Electronic device and connector
US-10896868-B2 · Jan 19, 2021 · US
Electronic device, connection body, and manufacturing method for electronic device
US-2020219797-A1 · Jul 9, 2020 · US
Electronic device
US-10615092-B2 · Apr 7, 2020 · US
Electronic device
US-10600712-B2 · Mar 24, 2020 · US
Electronic device and connection body
US-2020011904-A1 · Jan 9, 2020 · US
Electronic device and connection body
US-2019378782-A1 · Dec 12, 2019 · US
Semiconductor module
US-10461042-B2 · Oct 29, 2019 · US
Electronic device
US-2019237377-A1 · Aug 1, 2019 · US
Semiconductor module
US-10319704-B2 · Jun 11, 2019 · US
Heat dissipating structure
US-10251256-B2 · Apr 2, 2019 · US
Semiconductor device having a bypass capacitor
US-10243477-B2 · Mar 26, 2019 · US
Electronic device
US-2019051577-A1 · Feb 14, 2019 · US
Semiconductor device
US-10199486-B2 · Feb 5, 2019 · US
Semiconductor device
US-2018367054-A1 · Dec 20, 2018 · US
Semiconductor device
US-2018366567-A1 · Dec 20, 2018 · US
Heat dissipating structure
US-10159166-B2 · Dec 18, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shindengen Electric Mfg | 38 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 28 |
| H10W72/926 | 18 |
| H10W72/00 | 14 |
| H10W40/255 | 14 |
| H01L24/48 | 13 |