Forming conformable layer with flap on semiconductor devices
US-12068443-B1 · Aug 20, 2024 · US
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Moh Karsten patents
Moh Karsten is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Moh Karsten |
| Total patents | 12 |
| First publication | Jun 18, 2019 |
| Latest publication | Aug 20, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Forming conformable layer with flap on semiconductor devices
US-11145797-B1 · Oct 12, 2021 · US
Using underfill or flux to promote placing and parallel bonding of light emitting diodes
US-2021210667-A1 · Jul 8, 2021 · US
Using underfill or flux to promote placing and parallel bonding of light emitting diodes
US-10964867-B2 · Mar 30, 2021 · US
Molded etch masks
US-10910514-B1 · Feb 2, 2021 · US
Integrated elastomeric interface layer formation and singulation for light emitting diodes
US-10763135-B2 · Sep 1, 2020 · US
Using underfill or flux to promote placing and parallel bonding of light emitting diodes
US-2020111939-A1 · Apr 9, 2020 · US
Method for polymer-assisted chip transfer
US-10586725-B1 · Mar 10, 2020 · US
Method for polymer-assisted chip transfer
US-10559486-B1 · Feb 11, 2020 · US
Method for polymer-assisted chip transfer
US-10388516-B1 · Aug 20, 2019 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Facebook Tech Llc | 11 |
| Meta Platforms Tech Llc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 7 |
| H10P72/0446 | 7 |
| H10H20/01 | 7 |
| H10W72/0198 | 6 |
| H01L21/67144 | 5 |