Junction structure, method for manufacturing junction structure, and solder ball
US-12157189-B2 · Dec 3, 2024 · US
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Misawa Kensuke patents
Misawa Kensuke is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Misawa Kensuke |
| Total patents | 4 |
| First publication | Jan 13, 2022 |
| Latest publication | Dec 3, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
1-phenyl-2-phenylethane derivative
US-11453632-B2 · Sep 27, 2022 · US
Junction structure, method for manufacturing junction structure, and solder ball
US-2022241903-A1 · Aug 4, 2022 · US
1-phenyl-2-phenylethane derivative
US-2022009869-A1 · Jan 13, 2022 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kao Corp | 2 |
| Nippon Steel Chemical & Mat Co Ltd | 2 |
| Nippon Micrometal Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C07D263/32 | 2 |
| C07C39/21 | 2 |
| C07C233/18 | 2 |
| A61P5/28 | 2 |
| C07C39/12 | 2 |