Stiffener and package substrate for a semiconductor package
US-11295998-B2 · Apr 5, 2022 · US
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Mason Cory patents
Mason Cory is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mason Cory |
| Total patents | 2 |
| First publication | Oct 10, 2019 |
| Latest publication | Apr 5, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Stiffener and package substrate for a semiconductor package
US-2019311963-A1 · Oct 10, 2019 · US
Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H10W44/216 | 2 |
| H10W70/05 | 2 |
| H10W44/20 | 2 |
| H10W42/121 | 2 |