Wafer bonding process
US-2026082996-A1 · Mar 19, 2026 · US
Ma Kai is listed as an inventor on 102 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ma Kai |
| Total patents | 102 |
| First publication | Jul 30, 2015 |
| Latest publication | Mar 19, 2026 |
Publications ranked by popularity score, then publication date.
US-2026082996-A1 · Mar 19, 2026 · US
US-12528705-B2 · Jan 20, 2026 · US
US-12485189-B2 · Dec 2, 2025 · US
US-2025269054-A1 · Aug 28, 2025 · US
US-2025114484-A1 · Apr 10, 2025 · US
US-2025082204-A1 · Mar 13, 2025 · US
US-2025019249-A1 · Jan 16, 2025 · US
US-12115231-B2 · Oct 15, 2024 · US
US-12033964-B2 · Jul 9, 2024 · US
US-11931425-B2 · Mar 19, 2024 · US
Latest publications not already listed above.
US-11927736-B2 · Mar 12, 2024 · US
US-11763461-B2 · Sep 19, 2023 · US
US-2023201379-A1 · Jun 29, 2023 · US
US-11660354-B2 · May 30, 2023 · US
US-11657593-B2 · May 23, 2023 · US
US-2023140770-A1 · May 4, 2023 · US
US-2023066610-A1 · Mar 2, 2023 · US
US-2023037294-A1 · Feb 9, 2023 · US
US-11559591-B2 · Jan 24, 2023 · US
US-11559221-B2 · Jan 24, 2023 · US
US-2022363553-A1 · Nov 17, 2022 · US
US-11478212-B2 · Oct 25, 2022 · US
US-11419952-B2 · Aug 23, 2022 · US
US-11386291-B2 · Jul 12, 2022 · US
US-2022153596-A1 · May 19, 2022 · US
US-2022118106-A1 · Apr 21, 2022 · US
US-11291737-B2 · Apr 5, 2022 · US
US-11257259-B2 · Feb 22, 2022 · US
US-11246946-B2 · Feb 15, 2022 · US
US-11182925-B2 · Nov 23, 2021 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Cornell | 41 |
| Siemens Healthcare Gmbh | 39 |
| Memorial Sloan Kettering Cancer Center | 24 |
| Siemens Healthcare Diagnostics Inc | 8 |
| Univ Missouri | 6 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/20084 | 29 |
| A61K49/0093 | 29 |
| A61P35/00 | 26 |
| G06T2207/20081 | 25 |
| G06T2207/10028 | 22 |