Electroplating chamber leakage plating warning method and system
US-12573019-B2 · Mar 10, 2026 · US
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Lu Chenhua patents
Lu Chenhua is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lu Chenhua |
| Total patents | 8 |
| First publication | Nov 12, 2020 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate processing method
US-12486590-B2 · Dec 2, 2025 · US
Electroplating chamber leakage plating warning method and system
US-2025157019-A1 · May 15, 2025 · US
Electroplating apparatus
US-2024376627-A1 · Nov 14, 2024 · US
Substrate processing method
US-2024376625-A1 · Nov 14, 2024 · US
Electroplating apparatus and electroplating method
US-2024044038-A1 · Feb 8, 2024 · US
Plating apparatus
US-11859303-B2 · Jan 2, 2024 · US
Plating apparatus
US-2020354851-A1 · Nov 12, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Acm Research Shanghai Inc | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 6 |
| C25D21/10 | 4 |
| C25D17/00 | 4 |
| C25D17/06 | 4 |
| C25D21/12 | 3 |