Path-based layer stack connectivity check for plasma induced damage avoidance
US-12572701-B2 · Mar 10, 2026 · US
Ling Lei is listed as an inventor on 75 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ling Lei |
| Total patents | 75 |
| First publication | Feb 10, 2015 |
| Latest publication | Mar 10, 2026 |
Publications ranked by popularity score, then publication date.
US-12572701-B2 · Mar 10, 2026 · US
US-2025117524-A1 · Apr 10, 2025 · US
US-2024050530-A1 · Feb 15, 2024 · US
US-2023226151-A1 · Jul 20, 2023 · US
US-2023034473-A1 · Feb 2, 2023 · US
US-11564972-B2 · Jan 31, 2023 · US
US-2022241373-A1 · Aug 4, 2022 · US
US-11370841-B2 · Jun 28, 2022 · US
US-2022088140-A1 · Mar 24, 2022 · US
US-11241481-B2 · Feb 8, 2022 · US
Latest publications not already listed above.
US-11103554-B2 · Aug 31, 2021 · US
US-11065302-B2 · Jul 20, 2021 · US
US-11066454-B2 · Jul 20, 2021 · US
US-2021189519-A1 · Jun 24, 2021 · US
US-2021169983-A1 · Jun 10, 2021 · US
US-2020390859-A1 · Dec 17, 2020 · US
US-2020390858-A1 · Dec 17, 2020 · US
US-2020308668-A1 · Oct 1, 2020 · US
US-10758590-B2 · Sep 1, 2020 · US
US-10744185-B2 · Aug 18, 2020 · US
US-2020197489-A1 · Jun 25, 2020 · US
US-2020164035-A1 · May 28, 2020 · US
US-10597751-B2 · Mar 24, 2020 · US
US-2020054714-A1 · Feb 20, 2020 · US
US-10456449-B2 · Oct 29, 2019 · US
US-2019307847-A1 · Oct 10, 2019 · US
US-10413590-B2 · Sep 17, 2019 · US
US-10398758-B2 · Sep 3, 2019 · US
US-10369199-B2 · Aug 6, 2019 · US
US-2019194337-A1 · Jun 27, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ngm Biopharmaceuticals Inc | 69 |
| Purdue Research Foundation | 4 |
| Siemens Ind Software Inc | 2 |
| Ling Lei | 1 |
| Lindhout Darrin A | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| A61K38/1825 | 66 |
| C07K14/50 | 63 |
| C07K2319/30 | 33 |
| C07K2319/00 | 29 |
| A61K45/06 | 28 |