Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same
US-9869717-B2 · Jan 16, 2018 · US
This page is not indexed by search engines while we improve data quality.
Lim So-Young patents
Lim So-Young is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lim So-Young |
| Total patents | 9 |
| First publication | Jun 16, 2015 |
| Latest publication | Jan 16, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip on film package and display device including the same
US-2016351155-A1 · Dec 1, 2016 · US
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same
US-2016334463-A1 · Nov 17, 2016 · US
Chip on film package including distributed via plugs
US-9437526-B2 · Sep 6, 2016 · US
Chip on film package and display device including the same
US-2016162091-A1 · Jun 9, 2016 · US
Device and method for providing poi information using poi grouping
US-2016132513-A1 · May 12, 2016 · US
Chip on film package and display device including the same
US-9280182-B2 · Mar 8, 2016 · US
Semiconductor device with interposer and method manufacturing same
US-9059067-B2 · Jun 16, 2015 · US
Chip on film (COF) substrate, COF package and display device including the same
US-9059162-B2 · Jun 16, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
| Choi Yun-Seok | 1 |
| Lim So-Young | 1 |
| O In-Won | 1 |
| Sk Planet Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/688 | 4 |
| H10P74/273 | 2 |
| H10P74/00 | 2 |
| G09G3/006 | 2 |
| G01R31/2884 | 2 |