Via hole structure of circuit board, and circuit board
US-2026059652-A1 · Feb 26, 2026 · US
Li Jinlong is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li Jinlong |
| Total patents | 41 |
| First publication | May 12, 2016 |
| Latest publication | Feb 26, 2026 |
Publications ranked by popularity score, then publication date.
US-2026059652-A1 · Feb 26, 2026 · US
US-12523901-B2 · Jan 13, 2026 · US
US-12481186-B2 · Nov 25, 2025 · US
US-12451376-B2 · Oct 21, 2025 · US
US-12428367-B2 · Sep 30, 2025 · US
US-2025287112-A1 · Sep 11, 2025 · US
US-D1092301-S · Sep 9, 2025 · US
US-12311329-B1 · May 27, 2025 · US
US-2025154093-A1 · May 15, 2025 · US
US-2025069230-A1 · Feb 27, 2025 · US
Latest publications not already listed above.
US-2025038015-A1 · Jan 30, 2025 · US
US-2025004329-A1 · Jan 2, 2025 · US
US-2024402526-A1 · Dec 5, 2024 · US
US-D1050599-S · Nov 5, 2024 · US
US-2024276634-A1 · Aug 15, 2024 · US
US-11994759-B2 · May 28, 2024 · US
US-2024167925-A1 · May 23, 2024 · US
US-11822183-B2 · Nov 21, 2023 · US
US-2023342974-A1 · Oct 26, 2023 · US
US-11796859-B2 · Oct 24, 2023 · US
US-11772135-B2 · Oct 3, 2023 · US
US-11703716-B2 · Jul 18, 2023 · US
US-2023196573-A1 · Jun 22, 2023 · US
US-11672496-B2 · Jun 13, 2023 · US
US-2023076484-A1 · Mar 9, 2023 · US
US-2022369451-A1 · Nov 17, 2022 · US
US-2022299823-A1 · Sep 22, 2022 · US
US-2022221758-A1 · Jul 14, 2022 · US
US-11385159-B2 · Jul 12, 2022 · US
US-2022214579-A1 · Jul 7, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hisense Visual Tech Co Ltd | 12 |
| Shanghai United Imaging Healthcare Co Ltd | 5 |
| Tyco Electronics Shanghai Co Ltd | 4 |
| Univ Zhejiang | 3 |
| Zte Corp | 3 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02F1/133606 | 10 |
| G02F1/133603 | 10 |
| G02F1/133608 | 8 |
| G02F1/133314 | 6 |
| G02F1/133317 | 6 |