Multi-stage array based vertically integrated power delivery
US-12554302-B2 · Feb 17, 2026 · US
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Li Jianjun patents
Li Jianjun is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Li Jianjun |
| Total patents | 5 |
| First publication | Jan 19, 2017 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Field programmable solder ball grid array with embedded control systems
US-2025048561-A1 · Feb 6, 2025 · US
Multi-stage array based vertically integrated power delivery
US-2024370070-A1 · Nov 7, 2024 · US
Cooled system-on-wafer with means for reducing the effects of electrostatic discharge and/or electromagnetic interference
US-2024145432-A1 · May 2, 2024 · US
Thermal enhancement for quad flat no lead (qfn) packages
US-2017018487-A1 · Jan 19, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tesla Inc | 4 |
| Broadcom Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/756 | 2 |
| H10W40/10 | 2 |
| H01L2224/48245 | 2 |
| G06F1/266 | 2 |
| G06F1/26 | 2 |