Semiconductor packages and methods for manufacturing thereof
US-12300559-B2 · May 13, 2025 · US
Lee Swee Kat is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Swee Kat |
| Total patents | 1 |
| First publication | May 13, 2025 |
| Latest publication | May 13, 2025 |
Publications ranked by popularity score, then publication date.
US-12300559-B2 · May 13, 2025 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/01 | 1 |
| H10W70/411 | 1 |
| H10W74/00 | 1 |
| H10W90/756 | 1 |
| H10W70/479 | 1 |