Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
US-2020048075-A1 · Feb 13, 2020 · US
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Lee Swee Kah patents
Lee Swee Kah is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Swee Kah |
| Total patents | 1 |
| First publication | Feb 13, 2020 |
| Latest publication | Feb 13, 2020 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04R19/04 | 1 |
| H04R1/086 | 1 |
| H04R19/005 | 1 |
| B81B7/0035 | 1 |
| H04R1/04 | 1 |