Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same
US-9869717-B2 · Jan 16, 2018 · US
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Lee Sang-Heui patents
Lee Sang-Heui is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Sang-Heui |
| Total patents | 3 |
| First publication | Feb 10, 2015 |
| Latest publication | Jan 16, 2018 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/688 | 3 |
| H10P74/273 | 2 |
| H10P74/00 | 2 |
| G09G3/006 | 2 |
| G01R31/2884 | 2 |