Method and apparatus for predicting temperature of heat sink, and method for measuring junction temperature of power module using thereof
US-12560494-B2 · Feb 24, 2026 · US
Lee Jehwan is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Jehwan |
| Total patents | 9 |
| First publication | Jun 10, 2021 |
| Latest publication | Feb 24, 2026 |
Publications ranked by popularity score, then publication date.
US-12560494-B2 · Feb 24, 2026 · US
US-2025253700-A1 · Aug 7, 2025 · US
US-12026032-B2 · Jul 2, 2024 · US
US-2024142317-A1 · May 2, 2024 · US
US-11909195-B2 · Feb 20, 2024 · US
US-2023155366-A1 · May 18, 2023 · US
US-11556160-B2 · Jan 17, 2023 · US
US-2022083117-A1 · Mar 17, 2022 · US
US-2021173463-A1 · Jun 10, 2021 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 7 |
| Hyundai Motor Co Ltd | 2 |
| Kia Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F1/3212 | 4 |
| G06F1/28 | 4 |
| H02J7/96 | 3 |
| G06F1/26 | 3 |
| G01R21/00 | 2 |