Electronic device and semiconductor package with thermally conductive via
US-9674940-B2 · Jun 6, 2017 · US
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Lee Eung-Chang patents
Lee Eung-Chang is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Eung-Chang |
| Total patents | 2 |
| First publication | Feb 18, 2016 |
| Latest publication | Jun 6, 2017 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 2 |
| H10W90/752 | 2 |
| H10W90/734 | 2 |
| H10W90/732 | 2 |
| H10W90/724 | 2 |