CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-12552962-B2 · Feb 17, 2026 · US
This page is not indexed by search engines while we improve data quality.
Lee Eui Rang patents
Lee Eui Rang is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Eui Rang |
| Total patents | 10 |
| First publication | Jul 29, 2021 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-12516220-B2 · Jan 6, 2026 · US
Cmp slurry composition for polishing tungsten and method for polishing tungsten using the same
US-2025223479-A1 · Jul 10, 2025 · US
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-12139642-B2 · Nov 12, 2024 · US
Cmp slurry composition for polishing tungsten and method of polishing tungsten using the same
US-2024174890-A1 · May 30, 2024 · US
Cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-2023220241-A1 · Jul 13, 2023 · US
CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-11560495-B2 · Jan 24, 2023 · US
Cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-2022112401-A1 · Apr 14, 2022 · US
Cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-2022025214-A1 · Jan 27, 2022 · US
Cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
US-2021230451-A1 · Jul 29, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Sdi Co Ltd | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/403 | 10 |
| C09G1/02 | 10 |
| C09K3/1454 | 7 |
| C09K3/1436 | 6 |
| B24B37/044 | 5 |