Semiconductor package
US-11935847-B2 · Mar 19, 2024 · US
Lee Changbae is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Changbae |
| Total patents | 6 |
| First publication | Feb 13, 2020 |
| Latest publication | Mar 19, 2024 |
Publications ranked by popularity score, then publication date.
US-11935847-B2 · Mar 19, 2024 · US
US-2022262748-A1 · Aug 18, 2022 · US
US-11329014-B2 · May 10, 2022 · US
US-11159739-B2 · Oct 26, 2021 · US
US-2020312797-A1 · Oct 1, 2020 · US
US-2020053273-A1 · Feb 13, 2020 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 6 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/29 | 4 |
| H10W44/248 | 4 |
| H10W90/701 | 4 |
| H10W74/129 | 4 |
| H10W72/90 | 4 |