Systems and methods for improved metrology for semiconductor device wafers
US-12131959-B2 · Oct 29, 2024 · US
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Lavert Etay patents
Lavert Etay is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lavert Etay |
| Total patents | 6 |
| First publication | Dec 27, 2018 |
| Latest publication | Oct 29, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for improved metrology for semiconductor device wafers
US-2022344218-A1 · Oct 27, 2022 · US
Expediting spectral measurement in semiconductor device fabrication
US-11237120-B2 · Feb 1, 2022 · US
Expediting Spectral Measurement in Semiconductor Device Fabrication
US-2020393373-A1 · Dec 17, 2020 · US
Expediting spectral measurement in semiconductor device fabrication
US-10761034-B2 · Sep 1, 2020 · US
Expediting Spectral Measurement in Semiconductor Device Fabrication
US-2018372652-A1 · Dec 27, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kla Tencor Corp | 4 |
| Kla Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P74/203 | 6 |
| H10P74/27 | 6 |
| G01N21/9501 | 5 |
| H01L22/12 | 5 |
| H10P72/0606 | 4 |