Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-10243016-B2 · Mar 26, 2019 · US
This page is not indexed by search engines while we improve data quality.
Lamorey Mark patents
Lamorey Mark is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lamorey Mark |
| Total patents | 8 |
| First publication | Nov 9, 2017 |
| Latest publication | Mar 26, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-10236317-B2 · Mar 19, 2019 · US
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-2018233526-A1 · Aug 16, 2018 · US
Three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes
US-10002900-B2 · Jun 19, 2018 · US
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-2018138228-A1 · May 17, 2018 · US
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-9881956-B2 · Jan 30, 2018 · US
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-2017323919-A1 · Nov 9, 2017 · US
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment
US-2017323920-A1 · Nov 9, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L27/14687 | 8 |
| H01L27/14698 | 8 |
| H01L27/1464 | 8 |
| H01L27/14634 | 8 |
| H01L27/1469 | 8 |