Semiconductor package with balanced impedance
US-2026060153-A1 · Feb 26, 2026 · US
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Lamminger Egbert patents
Lamminger Egbert is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lamminger Egbert |
| Total patents | 8 |
| First publication | Nov 19, 2015 |
| Latest publication | Feb 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package with balanced impedance
US-12489040-B2 · Dec 2, 2025 · US
Power semiconductor device with a stress-free joint between metal parts and method for fabricating the same
US-2024332136-A1 · Oct 3, 2024 · US
Semiconductor Package with Balanced Impedance
US-2024079297-A1 · Mar 7, 2024 · US
Molded power semiconductor module and method for fabricating the same
US-2024047289-A1 · Feb 8, 2024 · US
Control device for a vehicle
US-11225146-B2 · Jan 18, 2022 · US
Control device for a vehicle
US-2021031632-A1 · Feb 4, 2021 · US
Operating device, in particular for a vehicle component, and method for the production thereof
US-2015330441-A1 · Nov 19, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Behr Hella Thermocontrol Gmbh | 3 |
| Infineon Technologies Ag | 3 |
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/481 | 5 |
| H10W90/00 | 4 |
| H10W74/111 | 4 |
| H10W74/114 | 4 |
| H10W40/255 | 4 |