Methods and apparatus to cool electronic devices
US-12581611-B2 · Mar 17, 2026 · US
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Koh Boon Ping patents
Koh Boon Ping is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Koh Boon Ping |
| Total patents | 48 |
| First publication | Mar 17, 2016 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Radiation shield with radiation shield gap
US-12471262-B2 · Nov 11, 2025 · US
Flexible printed circuit board arrangement
US-12424779-B2 · Sep 23, 2025 · US
Radiation shield and groove in support structure
US-12309984-B2 · May 20, 2025 · US
Methods and apparatus to manage noise for timing circuitry
US-2025107003-A1 · Mar 27, 2025 · US
Radiation shield with zipper
US-12250800-B2 · Mar 11, 2025 · US
Magnetic grounding techniques for cable shields
US-2023396025-A1 · Dec 7, 2023 · US
Ribbon shield device and method
US-2023317680-A1 · Oct 5, 2023 · US
RFI free picture frame metal stiffener
US-11658127-B2 · May 23, 2023 · US
Disaggregated die interconnection with on-silicon cavity bridge
US-11652057-B2 · May 16, 2023 · US
Recent patents
Latest publications not already listed above.
Flexible printed circuit board arrangement
US-2023123645-A1 · Apr 20, 2023 · US
Differential signal skew compensation technique for rfi mitigation with no reflection penalty
US-2023074049-A1 · Mar 9, 2023 · US
Low-cost surface mount emi gaskets
US-2023016486-A1 · Jan 19, 2023 · US
Slot antenna on a printed circuit board (PCB)
US-11552403-B2 · Jan 10, 2023 · US
Floating-bridge interconnects and methods of assembling same
US-11393760-B2 · Jul 19, 2022 · US
Radiation shield with radiation shield gap
US-2022110229-A1 · Apr 7, 2022 · US
Slot antenna on a printed circuit board (pcb)
US-2022052458-A1 · Feb 17, 2022 · US
Rod-based substrate with ringed interconnect layers
US-11239126-B2 · Feb 1, 2022 · US
Radiation shield with zipper
US-2022015272-A1 · Jan 13, 2022 · US
Radiation shield and groove in support structure
US-2021410341-A1 · Dec 30, 2021 · US
Slot antenna on a printed circuit board (PCB)
US-11211714-B2 · Dec 28, 2021 · US
Flexible printed circuit EMI enclosure
US-11178768-B2 · Nov 16, 2021 · US
Systems in packages including wide-band phased-array antennas and methods of assembling same
US-10978434-B2 · Apr 13, 2021 · US
Rod-based substrate with ringed interconnect layers
US-2021074598-A1 · Mar 11, 2021 · US
Shielded folded circuit board
US-10939540-B2 · Mar 2, 2021 · US
Floating-bridge interconnects and methods of assembling same
US-2020411438-A1 · Dec 31, 2020 · US
Rfi free picture frame metal stiffener
US-2020411448-A1 · Dec 31, 2020 · US
Disaggregated die interconnection with on-silicon cavity bridge
US-2020357744-A1 · Nov 12, 2020 · US
Floating-bridge interconnects and methods of assembling same
US-10796999-B2 · Oct 6, 2020 · US
Systems in packages including wide-band phased-array antennas and methods of assembling same
US-2020168592-A1 · May 28, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 48 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 19 |
| H10W90/724 | 16 |
| H10W42/20 | 12 |
| H10W90/701 | 11 |
| H10W74/142 | 10 |