Epoxy resin composition
US-10233324-B2 · Mar 19, 2019 · US
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Katou Shinya patents
Katou Shinya is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Katou Shinya |
| Total patents | 10 |
| First publication | Mar 10, 2015 |
| Latest publication | Mar 19, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
US-2017369700-A1 · Dec 28, 2017 · US
Flap in an adhesive tape for semiconductor manufacturing
US-D804435-S · Dec 5, 2017 · US
Tape for processing wafer, method for manufacturing tape for processing
US-9190309-B2 · Nov 17, 2015 · US
Tape for processing wafer, method for manufacturing tape for processing
US-2015279717-A1 · Oct 1, 2015 · US
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
US-9076832-B2 · Jul 7, 2015 · US
Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
US-9076833-B2 · Jul 7, 2015 · US
Epoxy resin composition
US-2015148451-A1 · May 28, 2015 · US
Adhesive sheet and method for manufacturing adhesive sheets
US-9011624-B2 · Apr 21, 2015 · US
Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method
US-8975161-B2 · Mar 10, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 7 |
| Katou Shinya | 4 |
| Komorida Kouji | 4 |
| Sakuta Tatsuya | 4 |
| Katou Rie | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09J2203/326 | 6 |
| H10P72/0442 | 5 |
| H10P54/00 | 5 |
| H10P72/7402 | 5 |
| H01L21/78 | 5 |