Integrated circuit device and semiconductor package including the same
US-12581932-B2 · Mar 17, 2026 · US
Huh Junho is listed as an inventor on 68 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Huh Junho |
| Total patents | 68 |
| First publication | Mar 2, 2017 |
| Latest publication | Mar 17, 2026 |
Publications ranked by popularity score, then publication date.
US-12581932-B2 · Mar 17, 2026 · US
US-2026003474-A1 · Jan 1, 2026 · US
US-2025338128-A1 · Oct 30, 2025 · US
US-2025293165-A1 · Sep 18, 2025 · US
US-12393871-B2 · Aug 19, 2025 · US
US-2025201468-A1 · Jun 19, 2025 · US
US-2025201702-A1 · Jun 19, 2025 · US
US-2025159342-A1 · May 15, 2025 · US
US-2025132775-A1 · Apr 24, 2025 · US
US-2025105223-A1 · Mar 27, 2025 · US
Latest publications not already listed above.
US-2025076963-A1 · Mar 6, 2025 · US
US-2025062691-A1 · Feb 20, 2025 · US
US-12225286-B2 · Feb 11, 2025 · US
US-12206756-B2 · Jan 21, 2025 · US
US-12181950-B2 · Dec 31, 2024 · US
US-2024427405-A1 · Dec 26, 2024 · US
US-2024371718-A1 · Nov 7, 2024 · US
US-12131696-B2 · Oct 29, 2024 · US
US-2024330038-A1 · Oct 3, 2024 · US
US-2024290738-A1 · Aug 29, 2024 · US
US-2024282672-A1 · Aug 22, 2024 · US
US-12057055-B2 · Aug 6, 2024 · US
US-2024234254-A9 · Jul 11, 2024 · US
US-2024136255-A1 · Apr 25, 2024 · US
US-2024096714-A1 · Mar 21, 2024 · US
US-2024038157-A1 · Feb 1, 2024 · US
US-2024029624-A1 · Jan 25, 2024 · US
US-11734067-B2 · Aug 22, 2023 · US
US-11722316-B2 · Aug 8, 2023 · US
US-2023107103-A1 · Apr 6, 2023 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 68 |
| Research & Business Found Sungkyunkwan Univ | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 14 |
| H10W90/724 | 11 |
| H10W90/722 | 11 |
| Y02D10/00 | 9 |
| G06F1/3287 | 9 |