Chip package structure, production method for chip package structure, and electronic device
US-2024213203-A1 · Jun 27, 2024 · US
Huang Shujun is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Huang Shujun |
| Total patents | 3 |
| First publication | Jul 29, 2021 |
| Latest publication | Jun 27, 2024 |
Publications ranked by popularity score, then publication date.
US-2024213203-A1 · Jun 27, 2024 · US
US-11827990-B2 · Nov 28, 2023 · US
US-2021230756-A1 · Jul 29, 2021 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ East China Science & Tech | 2 |
| Shimadzu China Co Ltd | 2 |
| Huawei Tech Co Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B01D61/465 | 2 |
| B01D61/466 | 2 |
| B01D61/445 | 2 |
| C25B9/23 | 2 |
| B01J47/08 | 2 |