Sandwiched multi-layer structure for cooling high power electronics
US-2025087557-A1 · Mar 13, 2025 · US
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Heschke Mitchell patents
Heschke Mitchell is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Heschke Mitchell |
| Total patents | 7 |
| First publication | Dec 4, 2018 |
| Latest publication | Mar 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Array of compliant connectors for electronic assemblies
US-2024356255-A1 · Oct 24, 2024 · US
Wafer alignment structure
US-2024234333-A9 · Jul 11, 2024 · US
Mechanical architecture for a multi-chip module
US-11973004-B2 · Apr 30, 2024 · US
Wafer alignment structure
US-2024136303-A1 · Apr 25, 2024 · US
Mechanical architecture for a multi-chip module
US-2021351104-A1 · Nov 11, 2021 · US
Acoustic compensation chamber for a remotely located audio device
US-10148800-B1 · Dec 4, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 3 |
| H10W40/47 | 3 |
| H10W40/625 | 2 |
| H10W40/60 | 2 |
| H10W70/685 | 2 |